EmTherm 200 Bond

EmTherm 200 Bond is a polyesterimide coated, self-bonding enamelled copper wire belonging in HC (200°C) thermal class, able to be manufactured in the diameter range of 0.20 – 0.80 mm.

EmTherm 200 Bond possess the feature of self-bonding through being kept at furnace at 160°-190°C temperature, blowing hot air at 200°C temperature, applying .

Fields of Use:

  • Step motors
  • Generators
  • Air coils
  • Speaker coils
  • Brake coils

Technical Information

Thermal Class (°C)Class HC, 200 °C
Insulation | Base CoatTHEIC Modified
Polyesterimide
Insulation | Top CoatPolyester Imide
Insulation | Bond CoatAromatik Poliamid
Production Range (mm) (mm)0.20 – 0.80 mm
Certification I.E.CIEC 60317 – 38
UL File No
Class Temerature (°C)200 °C
Heat Shock (°C)≥ 220 °C
Cut Through Temperature (°C)≥ 320 °C
Solderability (°C)Non solderability
Bonding Temperature (°C)160 °C – 190 °C
Re-Softening Temerature (°C)> 190 °C
Normal Solvent Resistance5H
Dipping Varnish ResistanceGood
Refrigerant ResistanceGood
Transformer Oil ResistanceNon Usable
Distinct FeaturesGenerator,
Electromechanical
Fields of UseBondable by eff max. 120 A/mm2 or alchol/ soproply,
Bondable by hot air (200°C),
Bondable by oven (160°C – 190°C),
High mechanical resistance,
Self Solderable Wire

bond

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