EmTherm 200 Bond is a polyesterimide coated, self-bonding enamelled copper wire belonging in HC (200°C) thermal class, able to be manufactured in the diameter range of 0.20 – 0.80 mm.
EmTherm 200 Bond possess the feature of self-bonding through being kept at furnace at 160°-190°C temperature, blowing hot air at 200°C temperature, applying.
Fields of Use:
| Thermal Class (°C) | Class HC, 200 °C |
| Insulation | Base Coat | THEIC Modified Polyesterimide |
| Insulation | Top Coat | Polyester Imide |
| Insulation | Bond Coat | Aromatik Poliamid |
| Production Range (mm) (mm) | 0.20 – 0.80 mm |
| Certification I.E.C | IEC 60317 – 38 |
| UL File No | |
| Class Temerature (°C) | 200 °C |
| Heat Shock (°C) | ≥ 220 °C |
| Cut Through Temperature (°C) | ≥ 320 °C |
| Solderability (°C) | Non solderability |
| Bonding Temperature (°C) | 160 °C – 190 °C |
| Re-Softening Temerature (°C) | > 190 °C |
| Normal Solvent Resistance | 5H |
| Dipping Varnish Resistance | Good |
| Refrigerant Resistance | Good |
| Transformer Oil Resistance | Non Usable |
| Distinct Features | Generator, Electromechanical |
| Fields of Use | Bondable by eff max. 120 A/mm2 or alchol/ soproply, Bondable by hot air (200°C), Bondable by oven (160°C – 190°C), High mechanical resistance, Self Solderable Wire |
