EmSold 180 Bond is a modified polyurethane enamelled copper wire belonging under HB (180°C) thermal class, able to be manufactured in the diameter range of 0.05 – 1.10 mm.
Providing thermal resistance up to 180°C and a good mechanical strength, EmSold 180 Bond is able to be soldered with the self-bonding upper layer. It possess the feature of flawless soldering at low temperature.
Fields of Use:
| Thermal Class (°C) | Class HB, 180 °C |
| Insulation | Base Coat | THEIC Modified Polyesterimide |
| Insulation | Top Coat | – |
| Insulation | Bond Coat | Aromatik Poliamid |
| Production Range (mm) (mm) | 0.08 – 1.30 mm |
| Certification I.E.C | IEC 60317 – 37 |
| UL File No | |
| Class Temerature (°C) | 180 °C |
| Heat Shock (°C) | ≥ 200 °C |
| Cut Through Temperature (°C) | ≥ 320 °C |
| Solderability (°C) | Non solderability |
| Bonding Temperature (°C) | 160 °C – 190 °C |
| Re-Softening Temerature (°C) | > 190 °C |
| Normal Solvent Resistance | 4H |
| Dipping Varnish Resistance | Good |
| Refrigerant Resistance | Good |
| Transformer Oil Resistance | Non Usable |
| Distinct Features | Handling Equipment, Transformers, Motors |
| Fields of Use | Bondable by eff max. 120 A/mm2 or alchol/ soproply, Bondable by oven (160°C – 190°C), High mechanical resistance, Self Solderable Wire |
