EmSold 180 Bond is a modified polyurethane enamelled copper wire belonging under HB (180°C) thermal class, able to be manufactured in the diameter range of 0.05 – 1.10 mm.
Providing thermal resistance up to 180°C and a good mechanical strength, EmSold 180 Bond is able to be soldered with the self-bonding upper layer. It possess the feature of flawless soldering at low temperature.
Fields of Use:
Thermal Class (°C) | Class HB, 180 °C |
Insulation | Base Coat | Modified Polyurethane |
Insulation | Top Coat | – |
Insulation | Bond Coat | Aromatik Poliamid |
Production Range (mm) (mm) | 0.05 – 1.10 mm |
Certification I.E.C | IEC 60317 – 36 |
UL File No | |
Class Temerature (°C) | 180 °C |
Heat Shock (°C) | ≥ 200 °C |
Cut Through Temperature (°C) | ≥ 230 °C |
Solderability (°C) | > 380°C | 1-2 s |
Bonding Temperature (°C) | Not Applicable |
Re-Softening Temerature (°C) | Not Applicable |
Normal Solvent Resistance | 3H – 3H |
Dipping Varnish Resistance | Good |
Refrigerant Resistance | Non Usable |
Transformer Oil Resistance | Non Usable |
Distinct Features | Transformers, Electromechanical, Motors, Automotive |
Fields of Use | Excellent solderability low temparatures, It can be produced red od green colours upon request of customer, Self Solderable Wire |